Intelligent planetary gear fault diagnosis system based on MEMS acoustic emission sensor.

Journal: Microsystems & nanoengineering
Published Date: Jun 18, 2025

Abstract

Early equipment fault diagnosis can identify potential risks, significantly reduce maintenance costs, and minimize property damage. However, vibration, strain, and force sensors operating at low frequencies with narrow bandwidths are insufficiently sensitive to fault information, making early fault prediction challenging. Here, we introduce a high-performance, cost-effective, and tiny-sized micro-electromechanical system (MEMS) acoustic emission sensor. This sensor utilizes a 10 × 11 hexagonal array of piezoelectric micromachined ultrasonic transducers with a chip size of 4 mm × 4 mm × 0.4 mm. The sensor is encapsulated using an epoxy/AlO composite for acoustic impedance matching, and its overall size is Φ 16 mm × H 5.5 mm, with a weight of approximately 3 g. This acoustic emission sensor achieves a peak sensitivity of 88.4 dB (ref. V/(m/s)) at 335 kHz, and its sensitivity remains above 60 dB across the frequency range from 15 kHz to 620 kHz. In addition, combined with the residual neural networks, an intelligent fault diagnosis of the planetary gear is realized. This MEMS acoustic emission sensor can provide a promising approach for in-situ fault monitoring of highly integrated and miniaturized industrial equipment.

Authors

  • Hanjie Dou
    Key Laboratory of Optoelectronic Technology & Systems of Ministry of Education, International R & D Center of Micro-nano Systems and New Materials Technology, Chongqing University, Chongqing, 400044, China.
  • Tao Liu
    Institute of Urology and Nephrology, The First Affiliated Hospital of Guangxi Medical University, Nanning, China.
  • Zhihao Li
    Heilongjiang University of CM, Harbin 150040, China.
  • Jixuan Zhang
    Key Laboratory of Optoelectronic Technology and Systems, Ministry of Education and International Research and Development Center of Micro-Nano Systems and New Materials Technology, Chongqing University, Chongqing, China.
  • Jiaqian Yang
    College of Environment, Zhejiang University of Technology, Hangzhou 310032, China.
  • Yuchen Mao
    Key Laboratory of Optoelectronic Technology and Systems, Ministry of Education and International Research and Development Center of Micro-Nano Systems and New Materials Technology, Chongqing University, Chongqing, China.
  • Wanyu Xu
    Key Laboratory of Optoelectronic Technology and Systems, Ministry of Education and International Research and Development Center of Micro-Nano Systems and New Materials Technology, Chongqing University, Chongqing, China.
  • Xiaojing Mu
    Key Disciplines Lab of Novel Micro-nano Devices and System Technology, Chongqing University, Chongqing 400030, China; Key Laboratory for Optoelectronic Technology & System of Ministry of Education, Chongqing University, Chongqing 400044, China; International R & D center of Micro-nano Systems and New Materials Technology, Chongqing University, Chongqing 400030, China; School of Optoelectronics Engineering, Chongqing University, Chongqing 400044, China.

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