All-aerosol-jet-printed Fe modified bilayers polyaniline flexible room temperature sensor with enhanced ammonia sensing properties.

Journal: Talanta
Published Date: Feb 1, 2025

Abstract

The rapid advancement of human-machine interaction (HMI), the Internet of Things (IoTs), and artificial intelligence (AI) has imposed greater demands on the ambient temperature wearable performance of sensors. In this study, the Fe modified bilayers polyaniline (PANI) flexible room temperature ammonia sensor is prepared by all-aerosol-jet-printed. The increased protonation degree of the PANI film produced by this method was elucidated through analysis of aerosol microdroplet evaporation behavior, while the improved ammonia sensing performance of the PANI/Fe dendritic structure was explained using soft and hard acid-base theory. Gas sensing tests demonstrated that the PANI/Fe sensor exhibited high sensitivity to ammonia (776 % at 55 ppm), a wide detection range (547 ppb-547 ppm), as well as excellent selectivity, flexibility, and cyclic stability. These results underscore its potential for application in ambient temperature wearable fields.

Authors

  • Shiji Liu
    Nanchang Key Laboratory for Advanced Manufacturing of Electronic Information Materials and Devices, International Institute for Innovation, Jiangxi University of Science and Technology, Nanchang, China.
  • Liang Shuai
    School of Chemistry and Food Science, Nanchang Normal University, Nanchang, China.
  • Qian Zhu
    Institute for Prevention and Control of AIDS and STD, Henan Center for Disease Control and Prevention, Zhengzhou 450016, Henan, China.
  • Lei Cao
    State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, Liaoning, People's Republic of China. Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang, Liaoning, People's Republic of China. University of Chinese Academy of Sciences, Beijing, People's Republic of China.
  • Feng Gu
    Institute of Computing Technology, Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing, China.
  • Lanlan Fan
    College of Mechanical Engineering, Wuhan Polytechnic University, Wuhan, China.
  • Shixian Xiong
    Nanchang Key Laboratory for Advanced Manufacturing of Electronic Information Materials and Devices, International Institute for Innovation, Jiangxi University of Science and Technology, Nanchang, China. Electronic address: s.xiong@jxust.edu.cn.

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