A 4×256 Gbps silicon transmitter with on-chip adaptive dispersion compensation.

Journal: Nature communications
Published Date: Jul 7, 2025

Abstract

The exponential growth of data traffic propelled by cloud computing and artificial intelligence necessitates advanced optical interconnect solutions. While wavelength division multiplexing (WDM) enhances optical module transmission capacity, chromatic dispersion becomes a critical limitation as single-lane rates exceed 200 Gbps. Here we demonstrate a 4-channel silicon transmitter achieving 1 Tbps aggregate data rate through integrated adaptive dispersion compensation. This transmitter utilizes Mach-Zehnder modulators with adjustable input intensity splitting ratios, enabling precise control over the chirp magnitude and sign to counteract specific dispersion. At 1271 nm (-3.99 ps/nm/km), the proposed transmitter enabled 4 × 256 Gbps transmission over 5 km fiber, achieving bit error ratio below both the soft-decision forward-error correction threshold with feed-forward equalization (FFE) alone and the hard-decision forward-error correction threshold when combining FFE with maximum-likelihood sequence detection. Our results highlight a significant leap towards scalable, energy-efficient, and high-capacity optical interconnects, underscoring its potential in future local area network WDM applications.

Authors

  • Shihuan Ran
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Yu Guo
    Animal Disease Control Center of Inner Mongolia, Hohhot, China.
  • Yuanbin Liu
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Ting Miao
    Beijing Advanced Innovation Center for Food Nutrition and Human Health, State Key Laboratory of Agro-Biotechnology, College of Biological Sciences, China Agricultural University, Beijing, China.
  • Yangbo Wu
    Huawei Technologies, Wireless BU, Shanghai, 201206, China.
  • Yang Qin
    Department of Biochemistry and Molecular Biology, West China School of Preclinical and Forensic Medicine, Sichuan University,Chengdu 610041,China.
  • Yuyao Guo
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Liangjun Lu
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Yixiao Zhu
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Yu Li
    Department of Public Health, Shihezi University School of Medicine, 832000, China.
  • Qunbi Zhuge
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China. qunbi.zhuge@sjtu.edu.cn.
  • Jianping Chen
    School of Earth Sciences and Resources, China University of Geosciences (Beijing), Beijing 100083, China.
  • And Linjie Zhou
    State Key Laboratory of Photonics and Communications, School of Information Science and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.

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