Dynamic predictive model for growth of Salmonella spp. in scrambled egg mix.

Journal: Food microbiology
PMID: 28213033

Abstract

Liquid egg products can be contaminated with Salmonella spp. during processing. A dynamic model for the growth of Salmonella spp. in scrambled egg mix - high solids (SEM) was developed and validated. SEM was prepared and inoculated with ca. 2 log CFU/mL of a five serovar Salmonella spp. cocktail. Salmonella spp. growth data at isothermal temperatures (10, 15, 20, 25, 30, 35, 37, 39, 41, 43, 45, and 47 °C) in SEM were collected. Baranyi model was used (primary model) to fit growth data and the maximum growth rate and lag phase duration for each temperature were determined. A secondary model was developed with maximum growth rate as a function of temperature. The model performance measures, root mean squared error (RMSE, 0.09) and pseudo-R (1.00) indicated good fit for both primary and secondary models. A dynamic model was developed by integrating the primary and secondary models and validated using two sinusoidal temperature profiles, 5-15 °C (low temperature) for 480 h and 10-40 °C (high temperature) for 48 h. The RMSE values for the sinusoidal low and high temperature profiles were 0.47 and 0.42 log CFU/mL, respectively. The model can be used to predict Salmonella spp. growth in case of temperature abuse during liquid egg processing.

Authors

  • Lin Li
    Department of Medicine III, LMU University Hospital, LMU Munich, Munich, Germany.
  • Jihan Cepeda
    Department of Food Science and Technology, University of Nebraska, Lincoln, NE 68583, USA.
  • Jeyamkondan Subbiah
    Department of Food Science and Technology, University of Nebraska, Lincoln, NE 68583, USA; Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE 68583, USA.
  • Glenn Froning
    Department of Food Science and Technology, University of Nebraska, Lincoln, NE 68583, USA.
  • Vijay K Juneja
    Residue Chemistry and Predictive Microbiology Research Unit, Eastern Regional Research Center, Agricultural Research Service, United States Department of Agriculture, Wyndmoor, PA, USA.
  • Harshavardhan Thippareddi
    Department of Food Science and Technology, University of Nebraska, Lincoln, NE 68583, USA. Electronic address: harsha.thippareddi@uga.edu.

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