S2LIC: Learned image compression with the SwinV2 block, Adaptive Channel-wise and Global-inter attention Context.

Journal: Neural networks : the official journal of the International Neural Network Society
Published Date:

Abstract

Recently, deep learning technology has been successfully applied in the field of image compression, leading to superior rate-distortion performance. It is crucial to design an effective and efficient entropy model to estimate the probability distribution of the latent representation. However, the majority of entropy models primarily focus on one-dimensional correlation processing between channel and spatial information. In this paper, we propose an Adaptive Channel-wise and Global-inter attention Context (ACGC) entropy model, which can efficiently achieve dual feature aggregation in both inter-slice and intra-slice contexts. Specifically, we divide the latent representation into different slices and then apply the ACGC model in a parallel checkerboard context to achieve faster decoding speed and higher rate-distortion performance. We utilize deformable attention in adaptive global-inter slices context to dynamically refine the attention weights based on the actual spatial correlation and context. Furthermore, in the main transformation structure, we introduce the Residual SwinV2 Transformer model to capture global feature information and utilize a dense block network as the feature enhancement module to improve the nonlinear representation of the image within the transformation structure. Experimental results demonstrate that our method achieves faster encoding and decoding speeds, with only 0.31 and 0.38 s, respectively. Additionally, our approach outperforms VTM-17.1 and some recent learned image compression methods in terms of PSNR metrics, reducing BD-Rate by 8.87%, 10.15% and 7.48% on three different datasets (i.e., Kodak, Tecnick and CLIC Pro). Our code will be available at https://github.com/wyq2021/S2LIC.git.

Authors

  • Yongqiang Wang
    Anyang Institute of Technology School of Electronic Information and Electrical Engineering, Anyang 455000, China.
  • Haisheng Fu
    School of Engineering Science, Simon Fraser University, Burnaby V5A1S6, Canada. Electronic address: haisheng_fu@sfu.ca.
  • Qi Cao
    Department of Urology, Robert H. Lurie Comprehensive Cancer Center, Chicago, IL, USA. qi.cao@northwestern.edu.
  • Shang Wang
    School of Microelectronics, Xi'an Jiaotong University, Xi'an 710049, China. Electronic address: y36958114@stu.xjtu.edu.cn.
  • Zhenjiao Chen
    School of Electronic Information, Northwestern Polytechnical University, Xi'an 710072, China; NO.58 Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, China. Electronic address: chenzhj@cksic.com.
  • Feng Liang
    PASTEUR, Département de Chimie, École Normale Supérieure, PSL Université, Sorbonne Université, CNRS, 75005 Paris, France.