Bioinspired Environment-Adaptable and Ultrasensitive Multifunctional Electronic Skin for Human Healthcare and Robotic Sensations.

Journal: Small (Weinheim an der Bergstrasse, Germany)
PMID: 37300351

Abstract

Multifunctional electronic skins (e-skins) that can sense various stimuli have demonstrated increasing potential in many fields. However, most e-skins are human-oriented that cannot work in hash environments such as high temperature, underwater, and corrosive chemicals, impairing their applications, especially in human-machine interfaces, intelligent machines, robotics, and so on. Inspired by the crack-shaped sensory organs of spiders, an environmentally robust and ultrasensitive multifunctional e-skin is developed. By developing a polyimide-based metal crack-localization strategy, the device has excellent environment adaptability since polyimide has high thermal stability and chemical durability. The localized cracked part serves as an ultrasensitive strain sensing unit, while the non-cracked serpentine part is solely responsible for temperature. Since the two units are made of the same material and process, the signals are decoupled easily. The proposed device is the first multifunctional e-skin that can be used in harsh environments, therefore is of great potential for both human and robot-oriented applications.

Authors

  • Chi Zhang
    Department of Thoracic Surgery, Union Hospital, Tongji Medical College, Huazhong University of Science and Technology, Wuhan, China.
  • Mengxi Wu
    State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian, Liaoning, 116024, China.
  • Shuye Cao
    State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian, Liaoning, 116024, China.
  • Mengjing Liu
    State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian, Liaoning, 116024, China.
  • Di Guo
  • Zhan Kang
    State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, 116024, China.
  • Ming Li
    Radiology Department, Huadong Hospital, Affiliated with Fudan University, Shanghai, China.
  • Dong Ye
    School of Instrumentation Science and Engineering, Harbin Institute of Technology, Harbin 150001, China.
  • Zhuoqing Yang
    National Key Laboratory of Science and Technology on Micro and Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
  • Xuewen Wang
    Institute of Flexible Electronics, Northwestern Polytechnical University, Xi'an, 710072, China.
  • Zhaoqian Xie
    State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University of Technology, Dalian 116024, China.
  • Junshan Liu
    State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian, Liaoning, 116024, China.

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