Deep-Learning-Based Analysis of Electronic Skin Sensing Data.

Journal: Sensors (Basel, Switzerland)
PMID:

Abstract

E-skin is an integrated electronic system that can mimic the perceptual ability of human skin. Traditional analysis methods struggle to handle complex e-skin data, which include time series and multiple patterns, especially when dealing with intricate signals and real-time responses. Recently, deep learning techniques, such as the convolutional neural network, recurrent neural network, and transformer methods, provide effective solutions that can automatically extract data features and recognize patterns, significantly improving the analysis of e-skin data. Deep learning is not only capable of handling multimodal data but can also provide real-time response and personalized predictions in dynamic environments. Nevertheless, problems such as insufficient data annotation and high demand for computational resources still limit the application of e-skin. Optimizing deep learning algorithms, improving computational efficiency, and exploring hardware-algorithm co-designing will be the key to future development. This review aims to present the deep learning techniques applied in e-skin and provide inspiration for subsequent researchers. We first summarize the sources and characteristics of e-skin data and review the deep learning models applicable to e-skin data and their applications in data analysis. Additionally, we discuss the use of deep learning in e-skin, particularly in health monitoring and human-machine interactions, and we explore the current challenges and future development directions.

Authors

  • Yuchen Guo
    Institute for Brain and Cognitive Sciences, Tsinghua University, Beijing, China.
  • Xidi Sun
    Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China.
  • Lulu Li
    School of Mathematics, Hefei University of Technology, Hefei, 230009, China. Electronic address: lilulu01@gmail.com.
  • Yi Shi
    College of Food Science and Engineering, Nanjing University of Finance and Economics/Collaborative Innovation Center for Modern Grain Circulation and Safety, Nanjing 210023, People's Republic of China.
  • Wen Cheng
    Department of Neurosurgery, Shengjing Hospital of China Medical University, Shenyang 110004, China.
  • Lijia Pan
    Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China.