Structural Electronic Skin for Conformal Tactile Sensing.

Journal: Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Published Date:

Abstract

The conformal integration of the electronic skin on the non-developable surface is in great demand for the comprehensive tactile sensing of robotics and prosthetics. However, the current techniques still encounter obstacles in achieving conformal integration of film-like electronic skin on non-developable surfaces with substantial curvatures for contact pressure detection and tactile mapping. In this paper, by utilizing the 3D printing technology to prepare the 3D electrode array in the structural component following its surface curvature, and covering it with a molded functional shell to form the pressure sensitive iontronic interface, a device is proposed to achieve high-sensitive pressure detection and high-fidelity tactile mapping on a complicated non-developable surface, called structural electronic skin (SES). The SES is prepared in a 3D printed fingertip with 46 tactile sensing units distributed on its curved surface, achieving the integration of both structural and tactile functions in a single component. By integrating the smart fingertip into a dexterous hand, a series of demonstrations are presented to show the dead-zone free pressure detection and tactile mapping with high sensitivity, for instance, 2D pulse wave monitoring and robotic injection in a medical robot, object recognition and compliant control in a smart prosthesis.

Authors

  • Sen Li
    Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian, China.
  • Jiantao Huang
    Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Meilan Wang
    Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Ka Deng
  • Chenhui Guo
    School of Mechatronic Engineering and Automation, Shanghai University, Shanghai, China.
  • Bin Li
    Department of Magnetic Resonance Imaging (MRI), Beijing Shijitan Hospital, Capital Medical University, Beijing, China.
  • Yu Cheng
  • Hongyan Sun
    School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China.
  • Hong Ye
    Department of Radiation Oncology, Beaumont Health, Royal Oak, Michigan.
  • Tingrui Pan
  • Yu Chang
    Department of Neurology, Tianjin First Central Hospital, Tianjin, China.