Ultrastretchable and highly conductive hydrogels based on Fe- lignin nanoparticles for subzero wearable strain sensor.

Journal: International journal of biological macromolecules
Published Date:

Abstract

Conductive hydrogels have attracted considerable interest for potential applications in soft robotics, electronic skin and human monitoring. However, insufficient mechanical characteristics, low adhesion and unsatisfactory electrical conductivity severely restrict future application possibilities of hydrogels. Herein, lignin nanoparticles (LNPs)-Fe-ammonium persulfate (APS) catalytic system was introduced to assemble Poly(2-hydroxyethyl methacrylate)/LNPs/Ca (PHEMA/LNPs/Ca) hydrogels. Due to the abundant metal coordination and hydrogen bonds, the composite hydrogel displayed ultrahigh stretchable capacity (3769 %), adhesion properties (248 kPa for skin) and self-healing performance. Importantly, hydrogel sensors possess with high durability, strain sensitivity (GF = 8.75), fast response time and freeze resistance (-20 °C) that could be employed to monitor motion signals in low-temperature regime. Therefore, the LNPs-Fe catalytic system has great potential in preparing hydrogel for various applications such as human-computer interaction, artificial intelligence, personal healthcare and subzero wearable devices. At the same time, incorporation of natural macromolecules into polymer hydrogels is tremendous research significance for investigating high-value utilization of lignin.

Authors

  • Fang Wang
    Key Laboratory of Intelligent Computing and Information Processing of Ministry of Education and Hunan Key Laboratory for Computation and Simulation in Science and Engineering, Xiangtan University, Xiangtan, China.
  • Cheng Chen
    Key Laboratory of Precision and Intelligent Chemistry, School of Chemistry and Materials Science, University of Science and Technology of China, China.
  • Dingfeng Zhu
    College of Chemical Engineering, Nanjing Forestry University, Nanjing 210037, China.
  • Wen Li
  • Jiaqi Liu
  • Jiajun Wang
    School of Electronic and Information Engineering, Soochow University, Suzhou 215006, People's Republic of China.