Large Scale Ultrafast Manufacturing of Wireless Soft Bioelectronics Enabled by Autonomous Robot Arm Printing Assisted by a Computer Vision-Enabled Guidance System for Personalized Wound Healing.

Journal: Advanced healthcare materials
PMID:

Abstract

A Customized wound patch for Advanced tissue Regeneration with Electric field (CARE), featuring an autonomous robot arm printing system guided by a computer vision-enabled guidance system for fast image recognition is introduced. CARE addresses the growing demand for flexible, stretchable, and wireless adhesive bioelectronics tailored for electrotherapy, which is suitable for rapid adaptation to individual patients and practical implementation in a comfortable design. The visual guidance system integrating a 6-axis robot arm enables scans from multiple angles to provide a 3D map of complex and curved wounds. The size of electrodes and the geometries of power-receiving coil are essential components of the CARE and are determined by a MATLAB simulation, ensuring efficient wireless power transfer. Three heterogeneous inks possessing different rheological behaviors can be extruded and printed sequentially on the flexible substrates, supporting fast manufacturing of large customized bioelectronic patches. CARE can stimulate wounds up to 10 mm in depth with an electric field strength of 88.8 mV mm. In vitro studies reveal the ability to accelerate cell migration by a factor of 1.6 and 1.9 for human dermal fibroblasts and human umbilical vein endothelial cells, respectively. This study highlights the potential of CARE as a clinical wound therapy method to accelerate healing.

Authors

  • Jihyun Kim
    Quality Evaluation Team, Samsung Bioepis Co., Ltd, Incheon, Republic of Korea.
  • Seol-Ha Jeong
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Brendan Craig Thibault
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Javier Alejandro Lozano Soto
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Hiroyuki Tetsuka
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, 65 Lansdowne Street, Cambridge, MA 02139, USA.
  • Surya Varchasvi Devaraj
    Electrical Engineering Department, Indian Institute of Technology Bombay India.
  • Estefania Riestra
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Yeongseok Jang
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Jeong Wook Seo
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Rafael Alejandro Cornejo Rodríguez
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02139, USA.
  • Lucia L Huang
    Department of Anesthesiology, Perioperative and Pain Medicine, Center for Accelerated Medical Innovation and Center for Nanomedicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02115, USA.
  • Yuhan Lee
    Department of Anesthesiology, Perioperative and Pain Medicine, Center for Accelerated Medical Innovation and Center for Nanomedicine, Brigham and Women's Hospital, Harvard Medical School, Boston, MA, 02115, USA.
  • Ioana Preda
    iPrint Institute, HEIA-FR, HES-SO University of Applied Sciences and Arts Western Switzerland, Fribourg, 1700, Switzerland.
  • Sameer Sonkusale
    Department of Electrical and Computer Engineering, Tufts University, 161 College Ave, Medford, MA, 02155, USA. Sameer.Sonkusale@tufts.edu.
  • Lance Fiondella
    Department of Electrical and Computer Engineering, University of Massachusetts- Dartmouth, Dartmouth, MA, 02747, USA.
  • Jungmok Seo
    School of Electrical and Electronic Engineering, Yonsei University, Seoul, 03722, Republic of Korea.
  • Lorenzo Pirrami
    iPrint Institute, HEIA-FR, HES-SO University of Applied Sciences and Arts Western Switzerland, Fribourg 1700, Switzerland.
  • Su Ryon Shin
    Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School; sshin4@bwh.harvard.edu.