Artificial neuromorphic cognitive skins based on distributed biaxially stretchable elastomeric synaptic transistors.

Journal: Proceedings of the National Academy of Sciences of the United States of America
PMID:

Abstract

Cephalopod (e.g., squid, octopus, etc.) skin is a soft cognitive organ capable of elastic deformation, visualizing, stealth, and camouflaging through complex biological processes of sensing, recognition, neurologic processing, and actuation in a noncentralized, distributed manner. However, none of the existing artificial skin devices have shown distributed neuromorphic processing and cognition capabilities similar to those of a cephalopod skin. Thus, the creation of an elastic, biaxially stretchy device with embedded, distributed neurologic and cognitive functions mimicking a cephalopod skin can play a pivotal role in emerging robotics, wearables, skin prosthetics, bioelectronics, etc. This paper introduces artificial neuromorphic cognitive skins based on arrayed, biaxially stretchable synaptic transistors constructed entirely out of elastomeric materials. Systematic investigation of the synaptic characteristics such as the excitatory postsynaptic current, paired-pulse facilitation index of the biaxially stretchable synaptic transistor under various levels of biaxial mechanical strain sets the operational foundation for stretchy distributed synapse arrays and neuromorphic cognitive skin devices. The biaxially stretchy arrays here achieved neuromorphic cognitive functions, including image memorization, long-term memorization, fault tolerance, programming, and erasing functions under 30% biaxial mechanical strain. The stretchy neuromorphic imaging sensory skin devices showed stable neuromorphic pattern reinforcement performance under both biaxial and nonuniform local deformation.

Authors

  • Hyunseok Shim
    Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802.
  • Seonmin Jang
    Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802.
  • Anish Thukral
    Department of Mechanical Engineering, University of Houston, Houston, TX 77204.
  • Seongsik Jeong
    School of Mechanical and Aerospace Engineering, Gyeongsang National University, Jinju 52828, Republic of Korea.
  • Hyeseon Jo
    School of Mechanical and Aerospace Engineering, Gyeongsang National University, Jinju 52828, Republic of Korea.
  • Bin Kan
    Department of Mechanical Engineering, University of Houston, Houston, TX 77204.
  • Shubham Patel
    Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802.
  • Guodan Wei
    Tsinghua-Berkeley Shenzhen Institute, Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518000, China.
  • Wei Lan
    School of Computer, Electronics and Information, Guangxi University, 100 Daxue East Road, Nanning, 530004, China.
  • Hae-Jin Kim
    School of Mechanical and Aerospace Engineering, Gyeongsang National University, Jinju 52828, Republic of Korea.
  • Cunjiang Yu
    Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802.